![]() It is suggested to use reflow oven with 10 or more heating zones. These are preheat, thermal soak (often shortened to just soak), reflow, and cooling. The final reflow temperature profile will depend on the type of solder paste and flux. An automatic profiling system (reflow process inspection) will automatically collect the thermal data at the board level for precise process control and allow traceability for every board that has been through reflow with the actual Thermal Profile, SPC, and Cpk stored for every board. ![]() The measurements are typically carried out using thermocouples attached to a high temperature resistant recording device which travels through the reflow oven with the PCB under test. In the conventional reflow soldering process, there are usually four stages, called “zones,” each having a distinct thermal profile. 9.4.2.1 Reflow Profile Board Preparation Reflow profile measurement is a vital part of setting up reflow solder conditions. The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. The features are as reflow profile check, temperature tester, thermal profiling, reflow profile, KIC temperature thermal, and KIC temperature profiler. Only through proper profiling can the actual component temperatures within a reflow soldering process become known. There are generally distinct phases or zones in the oven each with a distinct thermal profile pre -heat, (thermal) soak, reflow and cooling (see below). When used on boards containing a mix of SMT and THT components, through-hole reflow allows the wave soldering step to be eliminated from the assembly process, potentially reducing assembly costs. PCB profiling tools are used to create a repeatable, in-control soldering process that meets the specifications required by solder paste and/or component manufacturers. For a precise measurement of the temperatures during a reflow soldering. Reflow is not generally used on pure through-hole boards because wave soldering can be simpler and cheaper. measuring of the temperature profile during the lead-free reflow solder process. It can also be used for through-hole components by filling the holes with solder paste and inserting the component leads through the paste. The reflow oven recipe refers to the oven settings, including the zone temperatures, convection rates and gas flow rates. Reflow soldering is the most common method of attaching surface mount components to a circuit board. Heating can be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or by soldering individual joints with a hot air pencil. As a result, the solder melts, permanently connecting the joint. Subsequently, the entire assembly is subjected to controlled heat. Reflow soldering uses a solder paste to temporarily attach electrical components to their contact pads.
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